By Prof. Yangdong Deng, Prof. Wojciech P. Maly (auth.)
"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept that and value of third-dimensional (3-D) VLSI. The authors have built a brand new three-D IC integration paradigm, so-called 2.5-D integration, to handle many difficulties which are difficult to unravel utilizing conventional non-monolithic integration schemes. The e-book additionally introduces significant 3-D VLSI layout matters that have to be solved via IC designers and digital layout Automation (EDA) builders. by means of treating 3-D integration in an built-in framework, the e-book offers vital insights for semiconductor strategy engineers, IC designers, and people operating in EDA R&D.
Dr. Yangdong Deng is an affiliate professor on the Institute of Microelectronics, Tsinghua collage, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor on the division of electric and machine Engineering, Carnegie Mellon college, USA.
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Extra resources for 3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme
A vertical leap for microchips. Scientific American, Jan. 2002. [Online]. articleID = 000BD05C-D352-1C6A84A9809EC588EF21&sc = I100322.  M. Chan. The potential and realization of multi-layers three-dimensional integrated circuit. Int’l Solid-State and Integrated-Circuit Technology, 2001, 40 45. 5-Dimensional Integration Scheme  S. A. Kuhn, M. B. Kleiner, P. Ramm, W. Weber. Performance modeling of the interconnect structure of a three-dimensional integrated RISC processor/cache system. IEEE Trans.
5-D integration context. 5-D physical design tools. 5-D paradigm. 5-D integration scheme in Chapter 7. 5-D integration, we also discuss major design tradeoffs for several important categories of VLSI applications. We conclude the book in the final chapter by summing up our major contributions and outlining future research directions in fabrication, test, and design technologies. 5-D system integration. 5-D integration scheme into real-world industrial practices. References  NVidia Corporate, [online].
Int’l Electronic Device Meeting, 2000, pp. 165 168.  M. Koyanagi, H. Kurino, Kang Wook Lee, K. Sakuma, N. Miyakawa, H. Itani. Future system-on-silicon LSI chips. IEEE Micro, Vol. 18, July-Aug. 1998, pp. 17 22.  S. Strickland, E. Ergin, D. R. Kaeli, P. Zavracky. VLSI design in the 3rd dimension. Integration: the VLSI Journal, Vol. 25(1), Sep. 1998, pp. 1 16.  S. M. Alam, D. E. Troxel, C. V. Thompson. A comprehensive layout methodology and layout-specific circuit analyses for three-dimensional integrated circuits.
3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme by Prof. Yangdong Deng, Prof. Wojciech P. Maly (auth.)